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Tender Summary #34064374

Repair Of Plc Automation Module And Hmi Of Wafer Surface Grinder System

  • Sector: Scientific Research/instruments
  • Location: Delhi (Ne*******)
  • Language: English
  • Submission Date: 17 Mar, 2025
  • Ownership: Central Government/Public Sector
  • Sector: Scientific Research/instruments
  • Agency: Def*******ion

Key Values

Document Fees 0.0000 EMD 12461.0000 Tender Value 0.0000
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